The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Sep. 11, 2018
Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Dae Won Kim, Yongin-si, KR;

Yong Wook Cho, Yongin-si, KR;

Min Pyo Kim, Yongin-si, KR;

Jung Hye Park, Yongin-si, KR;

Won Kook Son, Yongin-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 4/28 (2016.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/52 (2010.01); F21K 9/232 (2016.01); F21V 23/06 (2006.01); F21K 9/66 (2016.01); F21Y 107/00 (2016.01); F21Y 115/10 (2016.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); F21V 3/02 (2006.01);
U.S. Cl.
CPC ...
F21S 4/28 (2016.01); F21K 9/232 (2016.08); F21V 23/06 (2013.01); H01L 27/156 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); F21K 9/66 (2016.08); F21V 3/02 (2013.01); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); H01L 2224/16245 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.


Find Patent Forward Citations

Kim, Dae. (2019). Light emitting devices and light emitting bulbs including the same (U.S. Patent No. 10234088). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10234088

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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