The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Mar. 09, 2016
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Tokyo Institute of Technology, Meguro-ku, JP;
Kazuhito Higuchi, Yokohama, JP;
Yusaku Asano, Yokohama, JP;
Kyoko Honma, Kawasaki, JP;
Kazuma Hiraguri, Yokohama, JP;
Yasunari Ukita, Kamakura, JP;
Masayuki Uchida, Yokohama, JP;
Toshiya Nakayama, Kawasaki, JP;
Mayumi Machino, Kawasaki, JP;
Masato Sone, Yokohama, JP;
Tso-Fu Mark Chang, Yokohama, JP;
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
TOKYO INSTITUTE OF TECHNOLOGY, Meguro-ku, JP;
Abstract
An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.