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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10233364 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Jun. 16, 2016

Extrudable hotmelt adhesives based on branched sis polymers

Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Marcus Heemann, Neuss, DE;

Sebastian Kostyra, Monheim, DE;

Eckhard Puerkner, Duesseldorf, DE;

Dirk Kasper, Duesseldorf, DE;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Ramsey Zacharia

Int. Cl.
CPC ...
C09J 125/04 (2006.01); C09J 153/02 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C09J 125/02 (2006.01); B32B 27/30 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/22 (2006.01); C09J 7/35 (2018.01); C09J 7/22 (2018.01); C08L 53/02 (2006.01); C08L 91/00 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 125/02 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/22 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/327 (2013.01); B32B 27/36 (2013.01); C08L 53/02 (2013.01); C08L 53/025 (2013.01); C08L 91/00 (2013.01); C09J 7/22 (2018.01); C09J 7/35 (2018.01); C09J 153/02 (2013.01); C09J 153/025 (2013.01); B32B 2250/24 (2013.01); B32B 2307/4026 (2013.01); B32B 2323/04 (2013.01); B32B 2367/00 (2013.01); B32B 2405/00 (2013.01); B32B 2439/00 (2013.01); C08L 2205/02 (2013.01); C09J 7/387 (2018.01); C09J 125/04 (2013.01); C09J 2205/114 (2013.01); C09J 2423/00 (2013.01); C09J 2425/00 (2013.01); C09J 2467/00 (2013.01);
Abstract

The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

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