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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10233324 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Jun. 05, 2013

Epoxy resin composition

Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Yukihiro Harada, Toyohashi, JP;

Satoshi Okamoto, Toyohashi, JP;

Kenta Narumori, Toyohashi, JP;

Tomoo Sano, Toyohashi, JP;

Akihiro Ito, Toyohashi, JP;

Masayuki Sugiura, Toyohashi, JP;

Tatsuhiro Kishikawa, Toyohashi, JP;

Shinya Katou, Toyohashi, JP;

Sanae Kita, Toyohashi, JP;

Assignee:

MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 1/08 (2006.01); B32B 15/20 (2006.01); B32B 15/14 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 59/72 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 1/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/4078 (2013.01); C08G 59/5093 (2013.01); C08G 59/72 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2307/306 (2013.01); B32B 2307/54 (2013.01); C08J 5/24 (2013.01); C08J 2363/00 (2013.01); C08J 2409/06 (2013.01); C08J 2463/02 (2013.01); C08L 2205/025 (2013.01); C08L 2207/53 (2013.01);
Abstract

An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.

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