The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Dec. 19, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Mark F. Schulz, Lake Elmo, MN (US);

Michael S. Wendland, North St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/04 (2006.01); C08K 5/47 (2006.01); C09C 1/00 (2006.01); G01N 21/78 (2006.01); C09B 29/08 (2006.01); C09B 29/033 (2006.01); C09C 3/08 (2006.01); C09C 1/02 (2006.01); C09C 1/28 (2006.01); C09B 69/00 (2006.01); C08K 7/20 (2006.01);
U.S. Cl.
CPC ...
C08K 5/47 (2013.01); C08K 7/20 (2013.01); C08K 9/04 (2013.01); C09B 29/0088 (2013.01); C09B 29/0801 (2013.01); C09B 29/0813 (2013.01); C09B 29/0827 (2013.01); C09B 29/0829 (2013.01); C09B 69/008 (2013.01); C09C 1/00 (2013.01); C09C 1/021 (2013.01); C09C 1/28 (2013.01); C09C 3/08 (2013.01); G01N 21/78 (2013.01);
Abstract

A compound represented by formula (I): and a treated filler having the compound on at least a portion of its surface. R is hydrogen or alkyl. X is alkylene, arylalkylene, or alkylarylene, each optionally interrupted by at least one of an ether, thioether, amine, amide, ester, thioester, carbonate, thiocarbonate, carbamate, thiocarbamate, urea, or thiourea, with alkylene optionally interrupted by arylene. W is hydroxyl, a sulfonic acid group, a phosphonic acid group, carboxylic acid group, —NHR, epoxy, or —Si(Y)(Z). Y is alkyl, aryl, arylalkylenyl, or alkylarylenyl. Z is halide, hydroxyl, alkoxy aryloxy, acyloxy, polyalkyleneoxy, —O— covalently bonded to the surface of the filler, or —O bonded to another silicon atom, and x is 0 or 1. A composition including the treated filler, a method of making the treated filler, and a method of determining the degree of cure of a curable polymeric resin are also disclosed.


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