The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

May. 12, 2014
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Chien-Hua Chen, Corvallis, OR (US);

Thomas R Strand, Corvallis, OR (US);

Michael G Groh, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); B41J 2/155 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); B29C 69/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1632 (2013.01); B29C 69/001 (2013.01); B41J 2/1404 (2013.01); B41J 2/14016 (2013.01); B41J 2/1433 (2013.01); B41J 2/14145 (2013.01); B41J 2/14201 (2013.01); B41J 2/155 (2013.01); B41J 2/1601 (2013.01); B41J 2/162 (2013.01); B41J 2/1603 (2013.01); B41J 2/1607 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1637 (2013.01); B41J 2/1645 (2013.01); H05K 1/186 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01); H05K 3/4007 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/1316 (2013.01);
Abstract

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.


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