The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Oct. 13, 2015
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Michael W. Cumbie, Albany, OR (US);

Silam J. Choy, Corvallis, OR (US);

Chien-Hua Chen, Corvallis, OR (US);

Devin Alexander Mourey, Albany, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/145 (2006.01); B41J 2/155 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/21 (2006.01);
U.S. Cl.
CPC ...
B41J 2/145 (2013.01); B41J 2/14072 (2013.01); B41J 2/155 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1632 (2013.01); B41J 2/1635 (2013.01); B41J 2/1637 (2013.01); B41J 2/2103 (2013.01); B41J 2002/14475 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/20 (2013.01); B41J 2202/22 (2013.01);
Abstract

A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns.


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