The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Aug. 28, 2017
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Daryl E. Anderson, Corvallis, OR (US);
George H. Corrigan, Corvallis, OR (US);
Scott A. Linn, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/045 (2006.01); B41J 2/155 (2006.01); B41J 2/175 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0458 (2013.01); B41J 2/14072 (2013.01); B41J 2/14112 (2013.01); B41J 2/14153 (2013.01); B41J 2/155 (2013.01); B41J 2/17546 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/13 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01);
Abstract
A fluidic die includes a number of sensors to measure properties of a number of property control elements associated with the printhead die, a pass gate to communicate a number of signals to an application specific integrated circuit (ASIC) via an analog bus using control logic associated with the pass gate, and a bi-directional configuration bus coupled to the fluidic die to transmit a number of control signals to property control elements located on the fluidic die.