The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Jun. 30, 2010
Applicant:

Takehiko Sumi, Kanagawa, JP;

Inventor:

Takehiko Sumi, Kanagawa, JP;

Assignee:

KYORAKU CO., LTD., Kamigyo-ku, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/12 (2006.01); B32B 37/15 (2006.01); B29C 49/00 (2006.01); B29C 49/20 (2006.01); B29C 51/14 (2006.01); B29C 51/10 (2006.01); B29C 44/22 (2006.01); B29C 47/00 (2006.01); B29C 47/06 (2006.01); B29C 47/08 (2006.01); B29C 47/14 (2006.01); B32B 5/18 (2006.01); B32B 27/06 (2006.01); B32B 7/04 (2019.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 38/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/153 (2013.01); B29C 44/22 (2013.01); B29C 47/0021 (2013.01); B29C 47/0042 (2013.01); B29C 47/0064 (2013.01); B29C 47/065 (2013.01); B29C 47/0816 (2013.01); B29C 47/145 (2013.01); B29C 49/0047 (2013.01); B29C 49/20 (2013.01); B29C 51/105 (2013.01); B29C 51/12 (2013.01); B29C 51/14 (2013.01); B32B 5/18 (2013.01); B32B 7/04 (2013.01); B32B 27/065 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B29C 2049/0057 (2013.01); B32B 38/12 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2266/025 (2013.01); B32B 2266/0228 (2013.01); B32B 2305/022 (2013.01); B32B 2307/732 (2013.01); B32B 2309/105 (2013.01); B32B 2309/14 (2013.01); B32B 2419/00 (2013.01); B32B 2457/00 (2013.01); B32B 2509/00 (2013.01); B32B 2605/08 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01); Y10T 428/249953 (2015.04); Y10T 428/249981 (2015.04);
Abstract

A skinned panel for stably molding a thin skin material and a molding method thereof. An extruding device is configured to extrude a pair of multilayered resin sheets, each of which has a lamination structure of an inner layer made of a foamed resin and an outer layer made of a non-foamed resin that is changed into a skin material of a sandwich panel as a skinned panel. The pair of the resin sheets is abutted to the circumferential part of the pair of the split molds for producing sealed spaces. The sealed spaces are sucked for pressing the pair of the resin sheets onto cavities of the pair of the split molds. Accordingly, the pair of the resin sheets is formed in a shape substantially identical to the outline of the sandwich panel.


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