The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2019
Filed:
Dec. 18, 2017
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventor:
Mathias Kaempf, Burglengenfeld, DE;
Assignee:
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); B23K 26/53 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/38 (2013.01); B23K 26/40 (2013.01); H01L 21/268 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 33/0095 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 2221/68327 (2013.01);
Abstract
The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.