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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10232471 B1

PDFFull Text
Date of Patent:
Mar. 19, 2019

Filed:

Dec. 18, 2017

Method for dividing a composite into semiconductor chips, and semiconductor chip

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventor:

Mathias Kaempf, Burglengenfeld, DE;

Assignee:

OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Stephen Bradley

Assistant Examiner:

Wasiul Haider

Int. Cl.
CPC ...
H01L 23/544 (2006.01); B23K 26/53 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/38 (2013.01); B23K 26/40 (2013.01); H01L 21/268 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 33/0095 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 2221/68327 (2013.01);
Abstract

The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.

Find Patent Forward Citations

Kaempf, Mathias. (2019). Method for dividing a composite into semiconductor chips, and semiconductor chip (U.S. Patent No. 10232471). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10232471

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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