The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Dec. 24, 2014
Applicant:

Hyosung Heavy Industries Corporation, Seoul, KR;

Inventors:

June-Sung Kim, Anyang-si, KR;

Hong-Ju Jung, Seoul, KR;

Jong-Yun Choi, Hwaseong-si, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H05K 7/20272 (2013.01); H05K 7/20927 (2013.01);
Abstract

The present invention relates to a modular cooling apparatus for a high-voltage direct-current transmission system. A sub-module () according to the present invention comprises a power unit () in the front and a capacitor unit () in the rear, and a heat sink () for discharging heat generated from the interior is provided in an interior space () of a power unit housing () forming the exterior of the power unit (). A coolant path () is provided in the interior of the heat sink (). The entrance and exit of the coolant path () are located adjacent to the bottom surface of the interior space (). Connecting couplers () for supplying coolant to the interior space () are provided on the sloped surface () on the bottom end of the front surface () of the power unit housing (). The sloped surface () is formed so as to face the ground at an angle. On both side surfaces of the power unit housing () are pass-through parts (), each of which is provided with a louver plate () having louvers () to allow air to circulate between the interior space () and the outside. As such, according to the present invention, heat is dissipated more effectively while damage to the sub-module () due to coolant leakage does not occur.


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