The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Sep. 11, 2012
Applicants:

Charles B. Woodhull, San Francisco, CA (US);

Paul Choiniere, Livermore, CA (US);

Michael Coleman, Cork, IE;

Bryan Patrick Kiple, Los Gatos, CA (US);

David A. Pakula, San Francisco, CA (US);

Michael K. Pilliod, Venice, CA (US);

Tang Yew Tan, San Francisco, CA (US);

Inventors:

Charles B. Woodhull, San Francisco, CA (US);

Paul Choiniere, Livermore, CA (US);

Michael Coleman, Cork, IE;

Bryan Patrick Kiple, Los Gatos, CA (US);

David A. Pakula, San Francisco, CA (US);

Michael K. Pilliod, Venice, CA (US);

Tang Yew Tan, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/00 (2006.01); H05K 5/04 (2006.01); B23P 11/00 (2006.01); B23P 17/00 (2006.01); G03F 1/38 (2012.01); H01Q 1/24 (2006.01); H04M 1/02 (2006.01); H05K 5/02 (2006.01); H05K 13/00 (2006.01); C25D 11/02 (2006.01); C25D 11/12 (2006.01); H05K 5/03 (2006.01); H01Q 1/42 (2006.01); C25D 11/34 (2006.01); B23C 5/10 (2006.01); B23C 5/00 (2006.01); B23P 17/02 (2006.01); H04M 1/11 (2006.01); C25D 11/24 (2006.01);
U.S. Cl.
CPC ...
H05K 5/04 (2013.01); B23C 5/00 (2013.01); B23C 5/1081 (2013.01); B23P 11/00 (2013.01); B23P 17/00 (2013.01); B23P 17/02 (2013.01); C25D 7/00 (2013.01); C25D 11/02 (2013.01); C25D 11/022 (2013.01); C25D 11/12 (2013.01); C25D 11/34 (2013.01); G03F 1/38 (2013.01); H01Q 1/243 (2013.01); H01Q 1/42 (2013.01); H04M 1/0254 (2013.01); H04M 1/11 (2013.01); H05K 5/02 (2013.01); H05K 5/0217 (2013.01); H05K 5/0243 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); H05K 13/00 (2013.01); B23C 2220/04 (2013.01); B23C 2220/16 (2013.01); B23C 2220/20 (2013.01); B23C 2220/28 (2013.01); B23C 2220/48 (2013.01); B23C 2226/31 (2013.01); B23C 2226/315 (2013.01); C25D 11/246 (2013.01); H04M 1/0249 (2013.01); Y10T 29/47 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/49826 (2015.01); Y10T 156/10 (2015.01); Y10T 156/1064 (2015.01); Y10T 407/1906 (2015.01); Y10T 409/300896 (2015.01); Y10T 409/30952 (2015.01); Y10T 409/303752 (2015.01);
Abstract

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.


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