The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Jun. 17, 2014
Applicant:
Flextronics Ap, Llc, Broomfield, CO (US);
Inventors:
Weifeng Liu, Dublin, CA (US);
Zhen Feng, San Jose, CA (US);
Anwar Mohammed, San Jose, CA (US);
David Geiger, Dublin, CA (US);
Murad Kurwa, San Jose, CA (US);
Assignee:
Flextronics AP, LLC., Broomfield, CO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/42 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); H05K 1/115 (2013.01); H05K 3/428 (2013.01);
Abstract
Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.