The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
May. 20, 2016
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Takayuki Tsukizawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A multilayer wiring board includes: a multilayer body including a plurality of insulating layers; a lower outer electrode provided on a lower surface of the multilayer body; a first via conductor connected at one end to the lower outer electrode; a first in-plane conductor connected to another end of the first via conductor; a second via conductor provided within the multilayer body on a surface of the first in-plane conductor on the opposite side from a surface of the first in-plane conductor in a position distanced from the first via conductor viewed in a direction orthogonal to a layering direction of the multilayer body, one end of the second via conductor being connected to the first in-plane conductor; and a second in-plane conductor connected to another end of the second via conductor. A line width of the first in-plane conductor is narrower than that of the second in-plane conductor.