The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Jun. 19, 2018
Applicant:

Oclaro Japan, Inc., Kanagawa, JP;

Inventor:

Daisuke Murakami, Kanagawa, JP;

Assignee:

Oclaro Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); G02B 6/13 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G02B 6/13 (2013.01); H05K 1/112 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01);
Abstract

There is provided an optical module including an optical subassembly including an optical element, a printed circuit board, and a connection substrate. The connection substrate includes a first connection portion connected to a first signal line conductor strip disposed on a first surface and a first ground conductor layer disposed on a second surface. The first connection portion includes a first signal line pad portion, a first ground pad portion, both disposed on the first surface, a second signal line pad portion disposed, and a second ground pad portion, both disposed on the second surface. In the connection substrate, a distance between the first signal line pad portion and the first ground pad portion in a first region is narrower than that in a second region farther from an inner end portion on the gap portion side than the first region in plan view.


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