The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Apr. 19, 2013
Universitat Bremen (Bccms), Bremen, DE;
Neue Materialien Bayreuth Gmbh, Bayreuth, DE;
Futurecarbon Gmbh, Bayreuth, DE;
Vasily Ploshikhin, Bayreuth, DE;
Andrey Prihodovsky, Bayreuth, DE;
Walter Schutz, Weidenberg, DE;
Stefan Forero, Weidenberg, DE;
Alexander Ilin, Bindlach, DE;
Helmut Bleier, Bischofsgrun, DE;
UNIVERSITAT BREMEN (BCCMS), Bremen, DE;
NEUE MATERIALIEN BAYREUTH GMBH, Weidenberg, DE;
FUTURECARBON GMBH, Bayreuth, DE;
Abstract
An electric heating device () is described which has at least one first electrically conductive component (), at least one heating layer () and at least one second electrically conductive component (). According to the invention, it is envisaged that the first electrically conductive component () and/or the second electrically conductive component () is/are produced and/or arranged on the heating layer () by means of a thermal spraying process. Alternatively or additionally, according to the invention, it is envisaged that the electrically conductive components () and the heating layer () are arranged with respect to one another in such a way that a current flow perpendicularly to the plane of the heating layer () and/or in the direction of the plane of the heating layer () is realized or can be realized. In order to produce an assembly (), such a heating device () can preferably be arranged on a substrate element (). Furthermore, a suitable production method is described.