The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Jul. 14, 2017
Applicant:

Sharp Laboratories of America, Inc., Camas, WA (US);

Inventors:

Kenji Alexander Sasaki, West Linn, OR (US);

Paul J. Schuele, Washougal, WA (US);

Mark Albert Crowder, Portland, OR (US);

Assignee:

eLux Inc., Vancouver, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/08 (2010.01); H01L 33/48 (2010.01); H01L 33/20 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 25/00 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 33/20 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83488 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/95146 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15155 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.


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