The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Mar. 12, 2014
Applicant:
Schweizer Electronic Ag, Schramberg, DE;
Inventors:
Thomas Gottwald, Dunningen, DE;
Alexander Neumann, Rottweil, DE;
Assignee:
SCHWEIZER ELECTRONIC AG, Schramberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49844 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H05K 1/185 (2013.01); H05K 3/4608 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/92 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/221 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/7625 (2013.01); H01L 2224/82001 (2013.01); H01L 2224/82007 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/82105 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/8388 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3511 (2013.01); H05K 1/188 (2013.01); H05K 3/30 (2013.01);
Abstract
An electronic sub-assembly () comprising at least one electronic component () embedded in a sequence of layers, wherein the electronic component () is arranged in a recess of an electrically conductive central layer () and directly adjoins a resin layer () on each side.