The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Sep. 14, 2017
Patrick Loney, Fairview Park, OH (US);
Robert Miles Young, Ellicott City, MD (US);
Daniel Robert Queen, Kensington, MD (US);
Aaron Ashley Hathaway, Baltimore, MD (US);
John X. Przybysz, Severna Park, MD (US);
Patrick Loney, Fairview Park, OH (US);
Robert Miles Young, Ellicott City, MD (US);
Daniel Robert Queen, Kensington, MD (US);
Aaron Ashley Hathaway, Baltimore, MD (US);
John X. Przybysz, Severna Park, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
An integrated circuit is provided that comprises a thermal sink layer, a first ground plane associated with a first set of circuits that have a first operational temperature requirement, and a first thermally conductive via that couples the first ground plane to the thermal sink layer. The circuit further comprises a second ground plane associated with a second set of circuits that have a second operational temperature requirement that is higher than the first operational temperature requirement, and a second thermally conductive via that couples the second ground plane to the thermal sink layer, wherein the first thermally conductive via has a greater volume of thermal conductive material than the second thermally conductive via to remove heat from the first set of circuits with less gradient than the second set of circuits.