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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10228119 B1

PDFFull Text
Date of Patent:
Mar. 12, 2019

Filed:

Oct. 31, 2016

Light source module

Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Jaepyo Hong, Seoul, KR;

Jaechan Kim, Seoul, KR;

Injoong Kim, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Peggy Neils

Int. Cl.
CPC ...
F21V 23/00 (2015.01); F21V 29/00 (2015.01); F21V 29/71 (2015.01); F21V 29/503 (2015.01); F21V 29/76 (2015.01); F21V 29/83 (2015.01); F21S 2/00 (2016.01); F21V 23/06 (2006.01); F21V 31/00 (2006.01); H01L 33/64 (2010.01); H05K 1/05 (2006.01); F21V 29/74 (2015.01); F21V 3/06 (2018.01); F21Y 115/10 (2016.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
F21V 29/713 (2015.01); F21S 2/005 (2013.01); F21V 23/06 (2013.01); F21V 29/503 (2015.01); F21V 29/74 (2015.01); F21V 29/763 (2015.01); F21V 29/83 (2015.01); F21V 31/00 (2013.01); H01L 33/64 (2013.01); H01L 33/647 (2013.01); H05K 1/053 (2013.01); F21V 3/0625 (2018.02); F21Y 2115/10 (2016.08); H05K 1/0209 (2013.01); H05K 3/107 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10969 (2013.01); H05K 2203/1355 (2013.01);
Abstract

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

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