The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2019

Filed:

Jul. 18, 2017
Applicant:

Vertera, Inc., Atlanta, GA (US);

Inventors:

Wei-Hsiang Chang, Duluth, GA (US);

Stephen Lee Laffoon, Atlanta, GA (US);

Christopher S. D. Lee, Atlanta, GA (US);

Assignee:

Vertera, Inc., Atlanta, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/04 (2006.01); B29C 67/20 (2006.01); C08J 9/26 (2006.01); B29C 44/58 (2006.01); B29C 33/00 (2006.01); B29K 71/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/04 (2013.01); B29C 33/00 (2013.01); B29C 44/58 (2013.01); B29C 67/202 (2013.01); C08J 9/26 (2013.01); B29K 2071/00 (2013.01); B29L 2031/753 (2013.01); B29L 2031/7532 (2013.01); C08J 2201/0446 (2013.01); C08J 2205/05 (2013.01); C08J 2300/22 (2013.01); C08J 2371/00 (2013.01);
Abstract

In general, in various embodiments, the present disclosure is directed systems and methods for producing a porous surface from a solid piece of polymer. In particular, the present disclosure is directed to systems that include a track assembly, mold assembly, press assembly, and methods for using the same for producing a porous surface from a solid piece of polymer. In some embodiments, the present systems and methods are directed to processing a polymer at a temperature below a melting point of the polymer to produce a solid piece of polymer with an integrated a porous surface.


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