The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jun. 29, 2015
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Daisuke Yamauchi, Osaka, JP;
Takatoshi Sakakura, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); H04R 31/00 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/44 (2006.01); G11B 5/48 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); H05K 3/0082 (2013.01); H05K 3/027 (2013.01); H05K 3/44 (2013.01); G11B 5/484 (2013.01); H05K 3/064 (2013.01); H05K 2201/0969 (2013.01); H05K 2203/0323 (2013.01);
Abstract
A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer, forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.