The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Nov. 25, 2016
Applicant:

Nsk Ltd., Tokyo, JP;

Inventors:

Masakazu Morimoto, Tokyo, JP;

Noboru Kaneko, Tokyo, JP;

Shin Kumagai, Tokyo, JP;

Assignee:

NSK LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01); B60R 16/023 (2006.01); H05K 7/14 (2006.01); B62D 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B60R 16/0231 (2013.01); H05K 1/0203 (2013.01); H05K 5/0017 (2013.01); H05K 7/1427 (2013.01); B62D 5/04 (2013.01); H05K 2201/068 (2013.01);
Abstract

A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.


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