The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Apr. 04, 2017
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yoshihiro Suzuki, Tokyo, JP;
Tomohide Yokozawa, Tokyo, JP;
Michitaka Okazaki, Yamagata, JP;
Takuro Aoki, Tokyo, JP;
Masashi Katsumata, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/115 (2013.01); H05K 1/182 (2013.01); H05K 3/30 (2013.01); H05K 3/4038 (2013.01); H05K 2201/10371 (2013.01);
Abstract
Disclosed herein is an electronic circuit module that includes a substrate having a power supply pattern, an electronic component mounted on a front surface of the substrate, a molding resin that covers the front surface of the substrate so as to embed the electronic component therein, a metal shield covering the molding resin, and a through conductor formed so as to penetrate through the molding resin to connect the metal shield to the power supply pattern.