The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Apr. 29, 2016
Applicants:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Stmicroelectronics (Malta) Ltd, Kirkop, MT;

Inventors:

Roberto Brioschi, Sesto San Giovanni, IT;

Alex Gritti, Vimercate, IT;

Kevin Formosa, Zabbar, MT;

Paul Anthony Barbara, Qawra, MT;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H04R 1/04 (2006.01); B81B 7/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/06 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B81B 7/008 (2013.01); B81B 7/0061 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H04R 1/06 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01);
Abstract

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.


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