The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Sep. 17, 2014
Applicant:

Daishinku Corporation, Kakogawa-shi, Hyogo, JP;

Inventors:

Tadataka Koga, Kakogawa, JP;

Tomo Fujii, Kakogawa, JP;

Kozo Shibutani, Kakogawa, JP;

Satoru Ishino, Kakogawa, JP;

Yoshinari Morimoto, Kakogawa, JP;

Kazuki Otani, Kakogawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/21 (2006.01); H01L 41/22 (2013.01); H03H 9/05 (2006.01); H03H 9/215 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/33 (2013.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0595 (2013.01); H01L 41/0475 (2013.01); H01L 41/053 (2013.01); H01L 41/33 (2013.01); H03H 3/02 (2013.01); H03H 9/02393 (2013.01); H03H 9/10 (2013.01); H03H 9/21 (2013.01); H03H 9/215 (2013.01); H03H 2003/026 (2013.01);
Abstract

This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. A pair of first and second metal bumps is formed in juxtaposition on the piezoelectric vibration piece. The coupling portion has slits extending in its width direction except in a bridge, i.e., a part of the coupling portion in its width direction. An end in the width direction of the bridge is distantly spaced from the first and second metal bumps both in a direction perpendicular to the width direction of the coupling portion with no overlap with these metal bumps.


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