The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Dec. 12, 2017
Applicants:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Usa Corp., Suwanee, GA (US);

Hisense International Co., Ltd., Qingdao, Shandong, CN;

Inventors:

Qiang Zhang, Shandong, CN;

Qisheng Zhao, Shandong, CN;

Chenghao Jin, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/068 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/06804 (2013.01); H01S 5/02212 (2013.01); H01S 5/02284 (2013.01); H01S 5/02415 (2013.01); H01S 5/4012 (2013.01);
Abstract

An optical module includes: a first thermoelectric cooler (TEC) disposed at least partially inside a laser, a second TEC is disposed on a housing of the laser, and a micro control unit (MCU). The first TEC is configured to perform heating or cooling according to an enabling signal input by aMCU. The second TEC is configured to perform heating or cooling according to an enabling signal input by the MCU. The MCU is configured to determine whether to input an enabling signal or a disabling signal to the first TEC and the second TEC according to a size of operating current input by a drive circuit of a laser chip to the laser chip.


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