The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jul. 22, 2016
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventors:

Lan-Chun Yang, Hsinchu, TW;

San-Yi Kuo, Hsinchu, TW;

Shun-Chung Kuo, Hsinchu, TW;

Chun-Wei Wang, Hsinchu, TW;

Assignee:

WISTRON NEWEB CORP., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/12 (2006.01); H01Q 19/13 (2006.01); F16M 13/02 (2006.01); H01Q 15/16 (2006.01); H01Q 3/06 (2006.01); F16H 25/20 (2006.01); F16B 2/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/1221 (2013.01); F16M 13/02 (2013.01); H01Q 1/125 (2013.01); H01Q 1/1207 (2013.01); H01Q 3/06 (2013.01); H01Q 15/16 (2013.01); H01Q 19/13 (2013.01); F16B 2/10 (2013.01); F16H 25/20 (2013.01);
Abstract

A support assembly is provided and includes an adapter, a stand, and a dish backing structure. The adapter includes two side plates and an upper plate. The side plates are respectively located at the two sides of the adapter. The upper plate is connected to the side plates and has a lower location hole. The stand is connected to the adapter. The dish backing structure has a receiving portion and includes a top wall and two side walls respectively located at the both sides of the receiving portion. The top wall has an upper location hole. When the receiving portion is connected to the adapter, a portion of the top wall abuts against the upper plate, and a gap is formed between the top wall and the upper plate. In addition, the upper location hole is aligned with the lower location hole.


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