The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jul. 18, 2014
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventor:
Yuta Kuroki, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/88 (2006.01); B32B 27/30 (2006.01); B32B 15/00 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 27/00 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); H01M 8/1004 (2016.01); H01M 8/1018 (2016.01); B05D 1/18 (2006.01); B05D 3/00 (2006.01);
U.S. Cl.
CPC ...
H01M 4/8814 (2013.01); B32B 15/00 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 27/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/30 (2013.01); B32B 27/304 (2013.01); B32B 27/322 (2013.01); H01M 4/881 (2013.01); H01M 4/8825 (2013.01); H01M 8/1004 (2013.01); H01M 8/1018 (2013.01); B05D 1/18 (2013.01); B05D 3/007 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2457/00 (2013.01); H01M 2008/1095 (2013.01); H01M 2300/0082 (2013.01);
Abstract
The present invention provides a sheet for thin layer transfer () including: a substrate () including a thin metal film or a thin heat-resistant resin film; and a fluorine resin layer () provided on at least one side of the substrate (). The sheet for thin layer transfer thus provided can have reduced surface irregularities and be less prone to deteriorate even when subjected to repeated thermal transfer by thermocompression bonding.