The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Oct. 07, 2014
Applicant:
The Trustees of the University of Pennsylvania, Philadelphia, PA (US);
Inventors:
I-Wei Chen, Swarthmore, PA (US);
Yang Lu, Wynnewood, PA (US);
Assignee:
The Trustees of the University of Pennsylvania, Philadelphia, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1641 (2013.01); G11C 13/0007 (2013.01); G11C 13/0069 (2013.01); H01L 45/10 (2013.01); H01L 45/145 (2013.01); H01L 45/146 (2013.01); G11C 2013/0083 (2013.01); G11C 2013/0095 (2013.01);
Abstract
Provided are methods of forming electric devices by effecting application of a stress to the device so as to deform the device within the device's elastic limit and to place the device into a new electric—e.g., resistance—state.
Chen, I-Wei. (2019). Mechanical forming of resistive memory devices (U.S. Patent No. 10224481). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10224481
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile