The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Nov. 09, 2017
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Akihito Fukunaga, Ashigara-kami-gun, JP;

Tetsu Miyoshi, Ashigara-kami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 31/00 (2006.01); H01L 41/312 (2013.01); H01L 41/37 (2013.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01); H01L 41/113 (2006.01); H01L 41/18 (2006.01); H01L 41/29 (2013.01); H01L 41/317 (2013.01); H01L 41/338 (2013.01); H04R 17/00 (2006.01); H04R 31/00 (2006.01); B32B 27/30 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 38/00 (2006.01); H01L 41/053 (2006.01); H01L 41/257 (2013.01); H01L 41/331 (2013.01);
U.S. Cl.
CPC ...
H01L 41/312 (2013.01); B32B 27/30 (2013.01); B32B 37/12 (2013.01); B32B 37/14 (2013.01); B32B 38/0004 (2013.01); H01L 41/047 (2013.01); H01L 41/0533 (2013.01); H01L 41/09 (2013.01); H01L 41/0973 (2013.01); H01L 41/113 (2013.01); H01L 41/1138 (2013.01); H01L 41/18 (2013.01); H01L 41/183 (2013.01); H01L 41/257 (2013.01); H01L 41/29 (2013.01); H01L 41/317 (2013.01); H01L 41/331 (2013.01); H01L 41/338 (2013.01); H01L 41/37 (2013.01); H04R 17/00 (2013.01); H04R 31/00 (2013.01); B32B 2255/00 (2013.01); B32B 2305/72 (2013.01); B32B 2307/10 (2013.01); B32B 2309/105 (2013.01);
Abstract

Provided are an electroacoustic conversion film web, an electroacoustic conversion film, and a method of manufacturing an electroacoustic conversion film web in which costs can be reduced by reducing the number of operations without damage to thin film electrodes, the points of electrode lead-out portions can be freely determined, and thus high productivity can be achieved. A preparation step of preparing an electrode laminated body in which a single thin film electrode and a single protective layer are laminated and a lamination step of laminating the electrode laminated body and an piezoelectric layer are included. A non-adhered portion that is not adhered to the piezoelectric layer is provided in at least one end portion of the thin film electrode in a case where the electrode laminated body and the piezoelectric layer are laminated in the lamination step.


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