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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10224464 B1

PDFFull Text
Date of Patent:
Mar. 05, 2019

Filed:

Dec. 22, 2015

Light emitting device package having lead electrode with varying thickness

Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Koji Abe, Tokushima, JP;

Yuki Shiota, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Kevin Parendo

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 33/005 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.

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