The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Dec. 14, 2015
Applicant:

Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;

Inventors:

Shogo Kamakura, Hamamatsu, JP;

Ryuta Yamada, Hamamatsu, JP;

Kenichi Sato, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); G01J 1/02 (2006.01); H01L 31/10 (2006.01); H01L 31/107 (2006.01); H04N 5/369 (2011.01); G01J 1/44 (2006.01); H01L 23/00 (2006.01); H01L 27/144 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/02005 (2013.01); G01J 1/02 (2013.01); G01J 1/44 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 27/1446 (2013.01); H01L 31/0203 (2013.01); H01L 31/02027 (2013.01); H01L 31/02322 (2013.01); H01L 31/10 (2013.01); H01L 31/107 (2013.01); H04N 5/369 (2013.01); G01J 2001/448 (2013.01); G01J 2001/4466 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A semiconductor substrate includes a first region in which a plurality of pixels are disposed and a second region located inside the first region to be surrounded by the first region when viewed from a direction in which a principal surface and a principal surface oppose each other. A through-hole penetrating through the semiconductor substrate is formed in the second region of the semiconductor substrate. An electrode disposed on a side of the principal surface of the semiconductor substrate and electrically connected to the plurality of pixels and an electrode disposed on a side of a principal surface of a mount substrate are connected to each other via a bonding wire inserted through the through-hole.


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