The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Oct. 03, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Satoru Tokuda, Hitachinaka, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 21/7688 (2013.01); H01L 21/76802 (2013.01); H01L 21/76895 (2013.01); H01L 23/535 (2013.01); H01L 29/66734 (2013.01);
Abstract

The present invention provides a semiconductor device that can reduce effects of noise without complicating processes or increasing chip area. The semiconductor device according to an aspect of the present invention includes a semiconductor substrate, a drain region, a drift region, a base region, a source region, a gate electrode, an interlayer insulating film, a conductive layer electrically coupled to the drain region, a wiring line, and a contact plug electrically coupled to the source region and the wiring line. The interlayer insulating film has an intermediate interlayer insulating film. The intermediate interlayer insulating film is arranged between the conductive layer and the contact plug. The intermediate interlayer insulating film is a thermal oxide film of a material that forms the conductive layer.


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