The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jul. 25, 2016
Applicants:

Shanghai Tianma Am-oled Co., Ltd, Shanghai, CN;

Tianma Micro-electronics Co., Ltd., Shenzhen, CN;

Inventors:

Chunyang Li, Shanghai, CN;

Dong Qian, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); H01L 27/32 (2006.01); G02F 1/1339 (2006.01); G06F 1/16 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); G02F 1/1368 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); G02F 1/1339 (2013.01); G02F 1/136286 (2013.01); G06F 1/163 (2013.01); G06F 1/1637 (2013.01); H01L 51/0096 (2013.01); H01L 51/5243 (2013.01); H01L 51/5246 (2013.01); G02F 1/1368 (2013.01); G02F 2001/133311 (2013.01); G02F 2001/136295 (2013.01); G02F 2201/56 (2013.01); G02F 2202/28 (2013.01); H01L 2251/53 (2013.01);
Abstract

A display panel and an electronic device are provided. The display panel comprises a base substrate including a display region and a border region surrounding the display region, wherein the border region includes an encapsulation region; a plurality of display units disposed in the display region; an encapsulation member disposed in the border region; a plurality of wires disposed in the border region; and a cover substrate arranged opposite to the base substrate. The display units and the wires are disposed between the base substrate and the cover substrate, the encapsulation member is disposed in the encapsulation region and configured to bond and fix the base substrate to the cover substrate, and at least one of the wires is disposed in the encapsulation region.


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