The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jun. 29, 2017
Applicant:
Neteera Technologies Ltd., Jerusalem, IL;
Inventors:
Assignee:
NETEERA TECHNOLOGIES LTD., Jerusalem, IL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H04N 5/378 (2011.01); G01J 5/08 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 9/28 (2006.01); H01Q 15/08 (2006.01); H01Q 19/06 (2006.01); H01Q 19/10 (2006.01); H01Q 21/06 (2006.01); H01Q 25/00 (2006.01); G01J 5/20 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14649 (2013.01); G01J 5/0837 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/14689 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 9/28 (2013.01); H01Q 15/08 (2013.01); H01Q 19/062 (2013.01); H01Q 19/108 (2013.01); H01Q 21/062 (2013.01); H01Q 25/001 (2013.01); H04N 5/378 (2013.01); G01J 2005/202 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract
An imaging sensor for accepting terahertz signals, including a die made of a dielectric material, one or more antennas for receiving terahertz signals, positioned on top of the die or in an upper layer of the die, each antenna having a CMOS detector electrically coupled to the antenna and positioned in the die below the antenna, a metal shield layer in the die below the antennas and above the CMOS detectors, shielding the CMOS detector from interference signals, a shielding layer under the die comprising a back metal coating and/or a layer of silver epoxy glue for attaching the bottom of the die to a lead frame.