The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Oct. 27, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventor:

Chunchen Liu, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 17/14 (2006.01); H01L 25/065 (2006.01); B23K 11/24 (2006.01); H02B 1/24 (2006.01); G11C 8/12 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 8/12 (2013.01); H03K 17/145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01);
Abstract

Systems, methods, and apparatus for operating an integrated circuit (IC) are provided. An apparatus may be configured to receive at one or more switches a signal from at least one circuit positioned on a first die lying within a first geometric plane, detect a signaling path between the at least one circuit positioned on the first die and at least one circuit positioned on a second die lying within a second geometric plane that is different from the first geometric plane, and control the one or more switches to route the signal along the signaling path. Circuits having a similar power characteristic are positioned adjacent to each other on the first die or the second die and circuits having a high temperature characteristic are positioned separate from each other on the first die or the second die.


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