The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jan. 31, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Wei Lin, Santa Clara, CA (US);

Nathan K. Gupta, San Francisco, CA (US);

Po-Jui Chen, Taipei, TW;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C08K 7/00 (2006.01); C08K 9/02 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); C08K 7/00 (2013.01); C08K 9/02 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/0862 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83201 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/07811 (2013.01);
Abstract

Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.


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