The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Mar. 02, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Koichiro Nishizawa, Tokyo, JP;
Takayuki Hisaka, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 29/812 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/544 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4817 (2013.01); H01L 21/76898 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 23/041 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 23/14 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 23/552 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 29/812 (2013.01); H01L 25/0657 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/35121 (2013.01);
Abstract
Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor deviceincludes a device substrate, a semiconductor circuit, a sealing frame, a cap substrate, via portions, electrodesand, and a bump portionor the like. A hollow portionin which the semiconductor circuitis housed in an airtight state is provided between the device substrateand the cap substrate. The bump portionconnects all the via portionsand the cap substrate. Thus, the via portionscan be reinforced using the bump portionA.