The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jan. 05, 2018
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventor:
Christian A. Witt, Woodbridge, CT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); H01L 21/76841 (2013.01); H01L 21/76847 (2013.01); H01L 21/76877 (2013.01); H01L 23/53233 (2013.01);
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to a soluble self-aligned barrier first for interconnect structure and methods of manufacture. The structure includes: a self-aligning barrier layer lining a trench of an interconnect structure; and an alloy interconnect material over the self-aligned barrier layer. The alloy interconnect material is an alloy composed of metal interconnect material and pre-anneal material that also forms the self-aligning barrier layer.