The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Oct. 18, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Edward C. Cooney, III, Jericho, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Zhong-Xiang He, Essex Junction, VT (US);

Robert K. Leidy, Burlington, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/522 (2006.01); H01L 23/525 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76843 (2013.01); H01L 21/76879 (2013.01); H01L 21/76885 (2013.01); H01L 23/3192 (2013.01); H01L 23/525 (2013.01); H01L 23/5227 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 23/3114 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01);
Abstract

Various aspects include an integrated circuit (IC), design structure, and a method of making the same. In one embodiment, the IC includes: a substrate; a dielectric layer disposed on the substrate; a set of wire components disposed on the dielectric layer, the set of wire components including a first wire component disposed proximate a second wire component; a bond pad disposed on the first wire component, the bond pad including an exposed portion; a passivation layer disposed on the dielectric layer about a portion of the bond pad and the set of wire components, the passivation layer defining a wire structure via connected to the second wire component; and a wire structure disposed on the passivation layer proximate the bond pad and connected to the second wire component through the wire structure via.


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