The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Oct. 04, 2017
Qualcomm Incorporated, San Diego, CA (US);
Ali Akbar Merrikh, Austin, TX (US);
Mehdi Saeidi, San Diego, CA (US);
Guoping Xu, San Diego, CA (US);
Damion Gastelum, Escondido, CA (US);
Luis Eduardo De Los Heros Beunza, San Diego, CA (US);
Ajay Vadakkepatt, San Diego, CA (US);
Rama Rao Goruganthu, Austin, TX (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Aspects of the disclosure are directed to a package including a substrate, die coupled to the substrate, wick deposited on the die, and an evaporation-condensation chamber having a hollowed bottom and two bottom lips, wherein the wick mates into the hollowed enclosure and substantially merges with the two bottom lips forming a sealed chamber. Other aspects are directed to a method of forming a package including coupling a die to a substrate, depositing a wick on the die, and mating the wick with an evaporation-condensation chamber having a hollowed enclosure and two bottom lips, wherein the mating attaches the wick into the hollowed enclosure and substantially merges the wick with the two bottom lips forming a sealed chamber. By directly depositing the wick over the die and integrating the wick with the encapsulation-condensation chamber, this integrated solution provides significant improvement in package thermal resistance especially for high-power and high-performance applications.