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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10224259 B1

PDFFull Text
Date of Patent:
Mar. 05, 2019

Filed:

Jun. 11, 2014

Resin composition for sealing semiconductor and semiconductor device

Applicant:

Sumitomo Bakelite Co., Ltd., Shinagawa-ku, JP;

Inventors:

Yui Ozaki, Tokyo, JP;

Katsushi Yamashita, Tokyo, JP;

Tomomasa Kashino, Tokyo, JP;

Assignee:

SUMITOMO BAKELITE CO., LTD., Shinagawa-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Michael F Pepitone

Int. Cl.
CPC ...
C08K 3/36 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); C08G 73/02 (2006.01); C08K 5/357 (2006.01); C08K 5/3445 (2006.01); C08K 5/378 (2006.01); C08K 5/548 (2006.01); H01L 21/56 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); C08G 73/12 (2006.01); C08K 5/35 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 73/0233 (2013.01); C08G 73/12 (2013.01); C08K 3/36 (2013.01); C08K 5/3445 (2013.01); C08K 5/357 (2013.01); C08K 5/378 (2013.01); C08K 5/548 (2013.01); H01L 21/56 (2013.01); H01L 23/49513 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); C08K 5/35 (2013.01); H01L 23/3107 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/181 (2013.01);
Abstract

The resin composition for sealing semiconductor according to the present invention is characterized by containing a maleimide-based compound represented by the following general formula (1), at least one of the benzoxazine-based compounds represented by the following general formula (2-1) and the following general formula (2-2), a curing catalyst, and an inorganic filler. In the general formulae (1), (2-1) and (2-2), each of X, Xand Xindependently represents an alkylene group having 1 to 10 carbon atoms, a group represented by the following general formula (3), a group represented by the formula '—SO—' or '—CO—', an oxygen atom or a single bond.

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