The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Apr. 19, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Shawn A. Adderly, Essex Junction, VT (US);

Samantha D. DiStefano, Burlington, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Max G. Levy, Essex Junction, VT (US);

Max L. Lifson, S. Burlington, VT (US);

Matthew D. Moon, Jeffersonville, VT (US);

Timothy D. Sullivan, Underhill, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); G01B 17/00 (2006.01); G01S 15/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G01B 17/00 (2013.01); G01S 15/42 (2013.01); H01L 21/68 (2013.01); Y10T 29/49764 (2015.01); Y10T 279/21 (2015.01);
Abstract

An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.


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