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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10224156 B1

PDFFull Text
Date of Patent:
Mar. 05, 2019

Filed:

Jul. 15, 2015

De-bouncing keypad and preparation method thereof

Applicant:

Nantong Memtech Technologies Co., Ltd., Nantong, Jiangsu, CN;

Inventors:

Huisheng Han, Jiangsu, CN;

Zhenxing Wang, Jiangsu, CN;

Yang Ding, Jiangsu, CN;

Hongmei Zhang, Jiangsu, CN;

Zhihao Dong, Jiangsu, CN;

Jie Shi, Jiangsu, CN;

Assignee:

Nantong Memtech Technologies Co., Ltd., Nantong Jiangsu, CN;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Ahmed M Saeed

Int. Cl.
CPC ...
H01H 13/10 (2006.01); H01H 1/021 (2006.01); C25D 3/56 (2006.01); C25D 3/60 (2006.01); C25D 5/02 (2006.01); H01H 1/025 (2006.01); H01H 11/06 (2006.01); C25D 5/34 (2006.01); C25D 5/36 (2006.01); C25D 5/40 (2006.01); C25D 7/00 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/52 (2006.01); H01H 13/785 (2006.01);
U.S. Cl.
CPC ...
H01H 13/10 (2013.01); C23C 18/1689 (2013.01); C23C 18/1692 (2013.01); C23C 18/32 (2013.01); C23C 18/52 (2013.01); C25D 3/56 (2013.01); C25D 3/60 (2013.01); C25D 5/02 (2013.01); C25D 5/34 (2013.01); C25D 5/36 (2013.01); C25D 5/40 (2013.01); C25D 7/00 (2013.01); H01H 1/021 (2013.01); H01H 1/025 (2013.01); H01H 11/06 (2013.01); H01H 13/785 (2013.01); H01H 2011/065 (2013.01); H01H 2201/002 (2013.01); H01H 2201/022 (2013.01); H01H 2229/014 (2013.01);
Abstract

The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.

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