The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jul. 08, 2014
Applicant:

Taiyo Yuden Co., Ltd., Taito-ku, Tokyo, JP;

Inventors:

Satoshi Kobayashi, Takasaki, JP;

Takahisa Fukuda, Takasaki, JP;

Tomoaki Nakamura, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/248 (2013.01);
Abstract

In an embodiment, a capacitor bodyof the multilayer ceramic capacitorhas protective partsmade of ceramics, capacitance-forming partscomprising multiple internal electrode layersstacked together with ceramic layersplaced in between, and a non-capacitance-forming partmade of ceramics, in the order of 'protective part—capacitance-forming part—non-capacitance-forming part—capacitance-forming part—protective part' from one side to the other side along the laminating direction, and Trepresenting the thickness of each protective partin the laminating direction, Trepresenting the thickness of each capacitance-forming partin the laminating direction, and Trepresenting the thickness of the non-capacitance-forming partin the laminating direction, satisfy the relationship of 'T<T≤T


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