The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Oct. 30, 2017
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Chi-Hsun Lee, Taipei, TW;

Hsieh-Shen Hsieh, Changhua County, TW;

Sen-Huei Chen, Yunlin County, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/04 (2006.01); H01L 23/00 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01L 49/02 (2006.01); H01F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 17/045 (2013.01); H01F 27/022 (2013.01); H01F 27/292 (2013.01); H01L 24/00 (2013.01); H01L 28/10 (2013.01); H01F 3/10 (2013.01); H01F 2017/048 (2013.01);
Abstract

An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body; a first metal layer, disposed on the body and electrically connected to a terminal of the conductive element; a conductive and adhesive layer, overlaying on the first metal layer; and a second metal layer, overlaying on the first metal layer and the conductive and adhesive layer, wherein a first conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer and the conductive and adhesive layer, and a second conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer without passing through the conductive and adhesive layer.


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