The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Jul. 12, 2011
Applicants:

Peter Englert, Bad Friedrichshall, DE;

Bernd Grünenwald, Nürtingen, DE;

Volker Kurz, Stuttgart, DE;

Inventors:

Peter Englert, Bad Friedrichshall, DE;

Bernd Grünenwald, Nürtingen, DE;

Volker Kurz, Stuttgart, DE;

Assignee:

MAHLE INTERNATIONAL GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28F 1/00 (2006.01); F28F 1/20 (2006.01); F28F 1/14 (2006.01); F28F 21/08 (2006.01); B21C 37/14 (2006.01); B21C 37/15 (2006.01); B21C 37/22 (2006.01); B23K 1/00 (2006.01); B23K 35/28 (2006.01); F28D 1/03 (2006.01); B23K 101/14 (2006.01);
U.S. Cl.
CPC ...
F28F 21/08 (2013.01); B21C 37/14 (2013.01); B21C 37/151 (2013.01); B21C 37/225 (2013.01); B23K 1/0012 (2013.01); B23K 35/286 (2013.01); F28D 1/0391 (2013.01); F28F 21/084 (2013.01); B23K 2101/14 (2018.08); F28F 2275/06 (2013.01);
Abstract

The invention relates to a fluid channel for a heat exchanger, comprising a metal sheet, wherein the metal sheet has at least one core region of an aluminum base alloy and at least one structure arranged inside the fluid channel, wherein the structure lies against a surface of the metal sheet and can be soldered to the metal sheet in a flux-free manner by way of a first soldering location in a soldering operation, and wherein a soldering region of the metal sheet and a counterpart lie against one another and can be soldered to one another in the same soldering operation as a second soldering location while wetting with flux, wherein an open path between the two soldering locations exists before the soldering operation.


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