The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Mar. 01, 2017
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Toshiaki Ezaki, Osaka, JP;

Soichi Uchida, Osaka, JP;

Kazuaki Matsumoto, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 7/00 (2006.01); C09K 5/14 (2006.01); C08L 67/00 (2006.01); C08L 67/02 (2006.01); F21S 45/47 (2018.01); F21V 29/76 (2015.01); F21V 29/87 (2015.01); H01L 33/64 (2010.01); F21Y 115/10 (2016.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
F21V 29/87 (2015.01); C08K 3/04 (2013.01); C08K 7/00 (2013.01); C08L 67/02 (2013.01); C08L 67/025 (2013.01); C09K 5/14 (2013.01); F21S 45/47 (2018.01); F21V 29/763 (2015.01); H01L 33/641 (2013.01); C08K 2201/016 (2013.01); C08L 2203/20 (2013.01); F21Y 2115/10 (2016.08); H01L 23/367 (2013.01); H01L 23/3737 (2013.01);
Abstract

An LED heat sink for vehicles includes an injection molded product of a thermally conductive resin composition. The thermally conductive resin composition includes 50 to 90 weight % of a thermoplastic polyester resin having a number average molecular weight of 12,000 to 70,000, and 10 to 50 weight % of a flaked graphite having a fixed carbon content of at least 98 mass %, and an aspect ratio of at least 21, and the thermally conductive resin composition has a specific gravity of 1.4 to 1.7, and an in-plane thermal conductivity of at least 1 W/(m·K).


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