The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Mar. 06, 2013
Applicant:

Philips Lighting Holding B.v., Eindhoven, NL;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 7/00 (2006.01); F21V 29/70 (2015.01); F21V 7/22 (2018.01); F21V 23/04 (2006.01); F21V 29/505 (2015.01); F21V 5/04 (2006.01); F21V 7/04 (2006.01); H01L 33/50 (2010.01); F21K 9/60 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); F21K 9/60 (2016.08); F21V 5/04 (2013.01); F21V 7/04 (2013.01); F21V 7/22 (2013.01); F21V 23/0457 (2013.01); F21V 29/505 (2015.01); H01L 33/50 (2013.01); F21V 7/0091 (2013.01); F21Y 2115/10 (2016.08); Y10T 29/4913 (2015.01);
Abstract

A light emitting device comprising a substrate () having an electrically conducting circuit layer (), a LED package () surface mounted on the substrate () and electrically connected to the circuit layer (), and a heat sink element, surface mounted on the substrate () separately from the LED package (), the heat sink element having a body () of a heat conductive material surrounding the LED package (), the body being thermally connected to the circuit layer (), and being adapted to provide heat dissipation from the circuit layer () to a surrounding environment, wherein a surface () of the heat sink element facing the LED package is adapted to form part of a beam shaping optics for shaping light emitted from the LED package. Since the heat sink body is in thermal contact with the circuit layer, the heat resistance from the LED package to the heat sink body via the circuit layer is minimized.


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